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Academic Calendar

Event Scheduled for Dec 7, 2018

Event: MSE M.S. Thesis Defense: Alexandra Merkouriou

Location: IPB-203

Time: 10:00 am

Details of Event:
MSE M.S. Thesis Defense

Presenter: Alexandra Merkouriou
Major Advisor: Dr. S. Pamir Alpay
Associate Advisors: Dr. Rainer Hebert and Dr. Lesley Frame

Date: Friday, December 7th, 2018
Time: 10:00am
Location: IPB-203

Title: Thermophysical Properties and Characterization of Diamond Silicon Carbide

Heat dissipation is a growing concern for multiple industries as technologies advance and is driving the need for materials with higher thermal conductivity than copper (400W/mK at room temperature) that can be made at reasonable manufacturing costs in a variety of shapes and sizes. Such advancements include metal and ceramic matrix composites with a diamond particulate phase such diamond silicon carbide (SiC). In this work, eight different particle sizes of diamond ranging from 22 μm to 500 μm were infiltrated with liquid silicon in a binder-less casting process to reduce the internal stress that results from binder migration and to determine the effect of particulate size on the thermophysical properties. In this process, the liquid silicon reacts with the diamond to form a SiC matrix phase, however, micrographs expose the creation of pores resulting from this process as well. X-ray diffraction results confirm the formation of β-SiC as well as diamond and silicon phases across the range of samples. Laser flash analysis was used to measure the thermal diffusivity of samples sliced to thicknesses of 0.5 mm and 5 mm allowing for an investigation of the thermal properties on both bulk and non-bulk materials. Thermal conductivity calculations revealed that the non-bulk samples out preformed the bulk samples with thermal conductivities ranging from 303 W/mK to 641 W/mK and 283 W/mK to 542 W/mK respectively. In conclusion, diamond particle sizes of 65 μm or higher achieve thermal conductivities superior to copper when produced using binder-less liquid silicon infiltration. However, there is room to improve processing parameters to reduce defects and create a more uniform material.

Target Audience: Not Available

Sponsored By: Materials Science and Engineering Department

Pamphlet/Flyer: No Pamphlet/Flyer Available

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