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Jeong-Ho Kim Assistant Professor Ph.D., University of Illinois at Urbana-Champaign, 2003 Castleman Building Rm 320 Phone: 860-486-2746 Fax: 860-486-2298 Email: This email address is being protected from spambots. You need JavaScript enabled to view it. Research focus: Computational Fracture & Damage Mechanics Functionally Graded Materials and Advanced Composites Multi-scale Modeling of Clean Energy Systems Modeling & Simulation of Blast and Fire-Resistance Research Website: Resume: Kim Resume |
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Recent publications:
G. Anandakumar, N. Li, A. Verma, P. Singh and J.-H. Kim, “Thermal Stress and Probability of Failure Analyses of Functionally Graded Solid Oxide Fuel Cells,” Journal of Power Sources, 195:6659-6670, 2010.G. Anandakumar and J.-H. Kim, “On the Modal Behavior of a Three-Dimensional Functionally Graded Cantilever Beam: Poisson’s ratio and Material Sampling Effects,” Composite Structures, 92:1358-1371, 2010.
C. Liu, J. T. DeWolf and J.-H. Kim, “Development of a Baseline for Structural Health Monitoring and Seismic Evaluation for a Curved Post-tensioned Concrete Box Girder Bridge,” Engineering Structures, 31: 3107-3115, 2009
G. Anandakumar and J.-H. Kim, “Dynamic, Modal and Wave Propagation Analyses of 3D Functionally Graded Continua,” Materials Science Forum, Vol 631-632:17-22, 2010.
L. Zhang and J.-H. Kim, “A complex variable approach for asymptotic mode-III crack-tip fields in an anisotropic functionally graded material,” Engineering Fracture Mechanics, Vol 76: 2512-2525, 2009.